MaAnt C1 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone

MaAnt C1 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A15 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair

Deskripsi :

Usage : Renovation Team
Material : Stainless Steel
is_customized : No
Model Number : For iPhone A8-A15
Type : Hand Tool Parts
Brand Name : MAANT
Origin : Mainland China
Product : MaAnt reballing kit,magnetic reballing kit,magnetic reballing,magnetic reballing kit iphone,reball station magnetic,relife emmc reball magnetic,mtk power ic reball stencil,reball machine vga,for iphone 12 reball stencil,reball machine,reball chip,magnetic stencil


MAGNETODYNAMIC TINPLANTING PLATFORM
Support lP series, Hisilicon series, Qualcomm series, etc
BGA maintenance positioning
Utility model patent No:.4

Strong magnetic adsorption

Simple operation
Precise positioning
Imported synthetic stone

thermostability
Antistatic
Automatic precise
positioning
New magnetic dynamic original positioning
Strong magnetic force automatic clamping, convenient
and flexible, supporting a variety of
CPU maintenance positioning and firm clamping
Magnetomotive force

Automatic and flexible, stable clamping,slide open the card and put the chipaccuratelyolt
can be automatically clamped by magnetic force when it is rele
ased , and the operation is simple and convenient

Installation method
Step 1:
Prepare the tin planting platform and close the chip with a smalltriangleFixed on the clamping position
(Note: it shall be consistentwith the direction of steel mesh)

Step 2:
Place the steel mesh directly on the slot of the magneticsuction base to complete the installation
(Note: check whether the mesh is aligned with the bottom chip)
Current model tin planting
net configuration
lt has a wide range of uses to meet your daily maintenance.
One set is in hand and you don't have to worry about

HAPPY SHOPPING.