RMA-218 NC-559-ASM BGA Solder Flux Paste Solder 100g Lead-Free for

Particle Size : 25-48m Model Number : Solder Flux Paste Origin : Mainland China Certification : CE Volume : 100 g / bottle Description: Model: NC-559-ASM; RMA-218 Volume: 100g / bottle It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. Feature: Excellent capacity of solder-stickiness Excellent Anti-wet Capacity Widely used on BGA, PGA, CSP packages and flip chip operation Suitable for multiple PCB reflow No-clean and Lead free for environmental protection Package Included: 1 xRMA-218 NC-559-ASM BGA Solder Flux Paste Solder 100g Lead-Free for SMT Reballing Soldering Welding Repair Paste