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Rp99.000
ARCTIC THERMAL PAD TP-3 (120x20mm, t:0.5mm, pack of 4pcs)
Rp99.000
- Kondisi: Baru
- Min. Pemesanan: 1 Buah
- Etalase: Semua Etalase
MINIMIZATION OF THERMAL RESISTANCE
The thinner the pad, the lower the thermal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm. Please note that due to the extremely low hardness, the installation of the 0.5 mm pad requires extra care.
VERSATILE APPLICATIONS
Heat-conducting, vibration-damping, mouldable, electrically insulating safe and easy to use. Thanks to its good compression properties, the soft heat conduction pad is particularly gentle on components and at the same time a good heat conductor. In addition to the standard format for M.2, the TP-3 is available in various sizes and thicknesses, which can be easily cut to the desired shape and size. This makes it ideal for RAMs, chipsets, and ICs of all kinds, which are used in PCs, laptops, consoles, graphics cards, and electronic devices in general.
BRIDGING GAPS
The TP-3 is softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances. Thanks to their good compressibility properties, the thermal pads act as the perfect gap filler and bridge uneven surface and air gaps without stressing sensitive and protruding components.
AVAILABLE IN DIFFERENT THICKNESSES AND SIZES
Our thermal pads are available in a choice of 0.5 mm, 1.0 mm, and 1.5 mm. The 0.5 mm variant is ideally suited as an alternative to heat-conducting foil. The pads are available in different dimensions, depending on their thickness. If required, the pads can also be independently cut to any size.
General Specifications :
* Colour: Blue
* Hardness: 55 Shore OO
* Continuous Use Temperature: -40~150 C
* Specific Gravity: 3.4 g/cm
* Dielectric Constant @1MHz: 5.19
* Volume Resistance: 2.69 x 1012 -cm
* Flammability Rating: UL 94 V-0
Packaging :
* Width: 95 mm
* Height: 1.5 mm
* Length: 140 mm
* Weight: 0.027 kg
The thinner the pad, the lower the thermal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm. Please note that due to the extremely low hardness, the installation of the 0.5 mm pad requires extra care.
VERSATILE APPLICATIONS
Heat-conducting, vibration-damping, mouldable, electrically insulating safe and easy to use. Thanks to its good compression properties, the soft heat conduction pad is particularly gentle on components and at the same time a good heat conductor. In addition to the standard format for M.2, the TP-3 is available in various sizes and thicknesses, which can be easily cut to the desired shape and size. This makes it ideal for RAMs, chipsets, and ICs of all kinds, which are used in PCs, laptops, consoles, graphics cards, and electronic devices in general.
BRIDGING GAPS
The TP-3 is softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances. Thanks to their good compressibility properties, the thermal pads act as the perfect gap filler and bridge uneven surface and air gaps without stressing sensitive and protruding components.
AVAILABLE IN DIFFERENT THICKNESSES AND SIZES
Our thermal pads are available in a choice of 0.5 mm, 1.0 mm, and 1.5 mm. The 0.5 mm variant is ideally suited as an alternative to heat-conducting foil. The pads are available in different dimensions, depending on their thickness. If required, the pads can also be independently cut to any size.
General Specifications :
* Colour: Blue
* Hardness: 55 Shore OO
* Continuous Use Temperature: -40~150 C
* Specific Gravity: 3.4 g/cm
* Dielectric Constant @1MHz: 5.19
* Volume Resistance: 2.69 x 1012 -cm
* Flammability Rating: UL 94 V-0
Packaging :
* Width: 95 mm
* Height: 1.5 mm
* Length: 140 mm
* Weight: 0.027 kg
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