Qianli CPU Module Motherboard Reballing Kit Stencils Tin Market Ol

Qianli CPU Module Motherboard Reballing Kit Stencils Tin Market Ol Kami Menyediakan Berbagai Macam Barang yang Anda Butuhkan - Item Pre-Order (6 - 10 Hari). - Semua Produk Berkualitas. - Pengiriman Cepat (Tergantung Alamat Pengiriman). - Hubungi Kami Untuk Menanyakan Ketersediaan Barang. Happy Shopping ! Features: 3D laser square hole BGA reballing stencil template. High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. New patented phone X Middle Layer Motherboard for Phone X Middle layer motherboard. Assisting professionals to do Phone X BGA reballing in the most convenient and safest way. Specification: Type: A7 CPU / A8 CPU / A9 CPU / A10 CPU / A11 CPU Package included: 1 x BGA Reballing Tool Details MOS-1463097