Description Solderless breadboard withh 400 tie point. It has 2 power buses, 10 columns, and 30 rows. All pins are spaced by a standard 0. 1Andquot.. The two sets of five columns are separated by about 0. 3Andquot., perfect for straddling a dip package over.
Perfect for Arduino shield prototyping and testing Accept wire with diameter20-29awg Voltage/current: 300v/3-5
Specifications
Solderless Breadboard - 400 Tie Points Each point is identified with letters across the top and number down the side Accepts most electronic components, including integrated circuits and transistors for digital and/or analog circuitry Keyed breadboard enabling them to be connected together Use to breadboard and debug circuit designs Low static, plastic body Designed for 5000 insertions per point Breadboard size: 3.3 x 2.2 x 0.3in (83 x 55 x 9mm)
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