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Stok Total: 500

Subtotal

Rp436.000

AMD Phenom II X2 550 3.1 GHz Dual-Core CPU Processor HDZ550WFK2DGI/HDX550WFK2DGM Socket AM3

Rp436.000
  • Kondisi: Baru
  • Waktu Preorder: 30 Hari
  • Min. Pemesanan: 1 Buah
  • Etalase: Semua Etalase
Brand Name : AMD
Origin : MY(Origin)
Type : Dual-Core
Application : Desktop
Processor Type : AMD Phenom
Socket Type : Socket AM3
Package : No
AMD Model : Phenom iix2 550
Launch Date : 2009
Chip Process : 45 nanometers
L2 Cache Capacity : 1MB
L3 Cache Capacity : 6MB
Number of Cores : Dual-Core
GPU-built : no
Unlocked : no
Support Chipset Models : AMD Others
Number OF Therads : 2
Default TDP / TDP : 80W
PCIe VERSION : PCIe 3.0
Support Memory Type : DDR3
Usage Scenario : others
Support Memory Channels : 2
Cooling system : no


Tip:

1:

the scratches on the

CPU are normal;

2. The origin of CPU is China and Malaysia, the origin does not affect the use, the performance is the same.Delivery is random;

3: This link contains only one

CPU, no cooler.

4.All CPUs sold by our store have exclusive seals. After sale, we need to rely on the seals. Otherwise, we will not deal with them.

AMD Phenom II X2 550 (rev. C3) specifications
The specs can be

for short-term

listings on auction and classifieds sites

General information

Type
CPU / Microprocessor

Market segment
Desktop

Family
AMD Phenom II X2

Model number
?

550

CPU part numbers
HDX550WFK2DGM

is an OEM/tray microprocessor
HDX550WFGMBOX

is a boxed microprocessor with fan and heatsink

Stepping code
CACAC AC

Frequency

?

3100 MHz

Bus speed

?

667 MHz Memory controllerOne 2000 MHz 16-bit HyperTransport link (4 GT/s)

Clock multiplier

?

15.5

Package
938-pin organic micro-PGA

Sockets

Socket AM2+Socket AM3

Weight
1.3oz / 38.2g (CPU)12.3oz / 349.8g (Box)

Fan/heatsink
PBT-GF30-FR

Introduction date
Nov 4, 2009

Architecture / Microarchitecture

Microarchitecture
K10

Platform
Dragon

Processor core
?

Callisto

Core stepping
?

RB-C3

CPUID
100F43

Manufacturing process
0.045 micron silicon-on-insulator (SOI) technology

Die size
258mm2

Data width

64 bit

The number of CPU cores

2

The number of threads

2

Floating Point Unit
Integrated

Level 1 cache size
?

2 x 64 KB 2-way set associative instruction caches2 x 64 KB 2-way set associative data caches

Level 2 cache size

?

2 x 512 KB 16-way set associative exclusive caches

Level 3 cache size

Shared 6 MB 48-way set associative cache

Cache latency
[1]

3 (L1 cache)15 (L2 cache)53 (L3 cache)

Multiprocessing
Uniprocessor

Features
MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a
?

AMD64 / AMD 64-bit technology
?

EVP / Enhanced Virus Protection
?

AMD-V / AMD Virtualization technology

Low power features
Cool'n'Quiet 3.0
CoolCore Technology
?

Dual Dynamic Power Management
?

Core C1 and C1E states
Package S0, S1, S3, S4 and S5 states

Integrated peripherals / components

Integrated graphics
None

Memory controller
The number of controllers: 1Memory channels: 2Channel width (bits): 72Supported memory: DDR2-1066, DDR3-1333DIMMs per channel: up to 2Maximum memory bandwidth (GB/s): 21.3

Other peripherals
HyperTransport 3 technology

Electrical / Thermal parameters

V core
?

0.875V - 1.4V

Maximum operating temperature
?

55C - 70C

Thermal Design Power

?

80 Watt

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