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Rp436.000
AMD Phenom II X2 550 3.1 GHz Dual-Core CPU Processor HDZ550WFK2DGI/HDX550WFK2DGM Socket AM3
Rp436.000
- Kondisi: Baru
- Waktu Preorder: 30 Hari
- Min. Pemesanan: 1 Buah
- Etalase: Semua Etalase
Brand Name : AMD
Origin : MY(Origin)
Type : Dual-Core
Application : Desktop
Processor Type : AMD Phenom
Socket Type : Socket AM3
Package : No
AMD Model : Phenom iix2 550
Launch Date : 2009
Chip Process : 45 nanometers
L2 Cache Capacity : 1MB
L3 Cache Capacity : 6MB
Number of Cores : Dual-Core
GPU-built : no
Unlocked : no
Support Chipset Models : AMD Others
Number OF Therads : 2
Default TDP / TDP : 80W
PCIe VERSION : PCIe 3.0
Support Memory Type : DDR3
Usage Scenario : others
Support Memory Channels : 2
Cooling system : no
Tip:
1:
the scratches on the
CPU are normal;
2. The origin of CPU is China and Malaysia, the origin does not affect the use, the performance is the same.Delivery is random;
3: This link contains only one
CPU, no cooler.
4.All CPUs sold by our store have exclusive seals. After sale, we need to rely on the seals. Otherwise, we will not deal with them.
AMD Phenom II X2 550 (rev. C3) specifications
The specs can be
for short-term
listings on auction and classifieds sites
General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
AMD Phenom II X2
Model number
?
550
CPU part numbers
HDX550WFK2DGM
is an OEM/tray microprocessor
HDX550WFGMBOX
is a boxed microprocessor with fan and heatsink
Stepping code
CACAC AC
Frequency
?
3100 MHz
Bus speed
?
667 MHz Memory controllerOne 2000 MHz 16-bit HyperTransport link (4 GT/s)
Clock multiplier
?
15.5
Package
938-pin organic micro-PGA
Sockets
Socket AM2+Socket AM3
Weight
1.3oz / 38.2g (CPU)12.3oz / 349.8g (Box)
Fan/heatsink
PBT-GF30-FR
Introduction date
Nov 4, 2009
Architecture / Microarchitecture
Microarchitecture
K10
Platform
Dragon
Processor core
?
Callisto
Core stepping
?
RB-C3
CPUID
100F43
Manufacturing process
0.045 micron silicon-on-insulator (SOI) technology
Die size
258mm2
Data width
64 bit
The number of CPU cores
2
The number of threads
2
Floating Point Unit
Integrated
Level 1 cache size
?
2 x 64 KB 2-way set associative instruction caches2 x 64 KB 2-way set associative data caches
Level 2 cache size
?
2 x 512 KB 16-way set associative exclusive caches
Level 3 cache size
Shared 6 MB 48-way set associative cache
Cache latency
[1]
3 (L1 cache)15 (L2 cache)53 (L3 cache)
Multiprocessing
Uniprocessor
Features
MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a
?
AMD64 / AMD 64-bit technology
?
EVP / Enhanced Virus Protection
?
AMD-V / AMD Virtualization technology
Low power features
Cool'n'Quiet 3.0
CoolCore Technology
?
Dual Dynamic Power Management
?
Core C1 and C1E states
Package S0, S1, S3, S4 and S5 states
Integrated peripherals / components
Integrated graphics
None
Memory controller
The number of controllers: 1Memory channels: 2Channel width (bits): 72Supported memory: DDR2-1066, DDR3-1333DIMMs per channel: up to 2Maximum memory bandwidth (GB/s): 21.3
Other peripherals
HyperTransport 3 technology
Electrical / Thermal parameters
V core
?
0.875V - 1.4V
Maximum operating temperature
?
55C - 70C
Thermal Design Power
?
80 Watt
Origin : MY(Origin)
Type : Dual-Core
Application : Desktop
Processor Type : AMD Phenom
Socket Type : Socket AM3
Package : No
AMD Model : Phenom iix2 550
Launch Date : 2009
Chip Process : 45 nanometers
L2 Cache Capacity : 1MB
L3 Cache Capacity : 6MB
Number of Cores : Dual-Core
GPU-built : no
Unlocked : no
Support Chipset Models : AMD Others
Number OF Therads : 2
Default TDP / TDP : 80W
PCIe VERSION : PCIe 3.0
Support Memory Type : DDR3
Usage Scenario : others
Support Memory Channels : 2
Cooling system : no
Tip:
1:
the scratches on the
CPU are normal;
2. The origin of CPU is China and Malaysia, the origin does not affect the use, the performance is the same.Delivery is random;
3: This link contains only one
CPU, no cooler.
4.All CPUs sold by our store have exclusive seals. After sale, we need to rely on the seals. Otherwise, we will not deal with them.
AMD Phenom II X2 550 (rev. C3) specifications
The specs can be
for short-term
listings on auction and classifieds sites
General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
AMD Phenom II X2
Model number
?
550
CPU part numbers
HDX550WFK2DGM
is an OEM/tray microprocessor
HDX550WFGMBOX
is a boxed microprocessor with fan and heatsink
Stepping code
CACAC AC
Frequency
?
3100 MHz
Bus speed
?
667 MHz Memory controllerOne 2000 MHz 16-bit HyperTransport link (4 GT/s)
Clock multiplier
?
15.5
Package
938-pin organic micro-PGA
Sockets
Socket AM2+Socket AM3
Weight
1.3oz / 38.2g (CPU)12.3oz / 349.8g (Box)
Fan/heatsink
PBT-GF30-FR
Introduction date
Nov 4, 2009
Architecture / Microarchitecture
Microarchitecture
K10
Platform
Dragon
Processor core
?
Callisto
Core stepping
?
RB-C3
CPUID
100F43
Manufacturing process
0.045 micron silicon-on-insulator (SOI) technology
Die size
258mm2
Data width
64 bit
The number of CPU cores
2
The number of threads
2
Floating Point Unit
Integrated
Level 1 cache size
?
2 x 64 KB 2-way set associative instruction caches2 x 64 KB 2-way set associative data caches
Level 2 cache size
?
2 x 512 KB 16-way set associative exclusive caches
Level 3 cache size
Shared 6 MB 48-way set associative cache
Cache latency
[1]
3 (L1 cache)15 (L2 cache)53 (L3 cache)
Multiprocessing
Uniprocessor
Features
MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a
?
AMD64 / AMD 64-bit technology
?
EVP / Enhanced Virus Protection
?
AMD-V / AMD Virtualization technology
Low power features
Cool'n'Quiet 3.0
CoolCore Technology
?
Dual Dynamic Power Management
?
Core C1 and C1E states
Package S0, S1, S3, S4 and S5 states
Integrated peripherals / components
Integrated graphics
None
Memory controller
The number of controllers: 1Memory channels: 2Channel width (bits): 72Supported memory: DDR2-1066, DDR3-1333DIMMs per channel: up to 2Maximum memory bandwidth (GB/s): 21.3
Other peripherals
HyperTransport 3 technology
Electrical / Thermal parameters
V core
?
0.875V - 1.4V
Maximum operating temperature
?
55C - 70C
Thermal Design Power
?
80 Watt
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